Home > News >

Weekly News Update: Viasat and Inmarsat to Combine; NXP and Ford Collaborate to Deliver Next-Generation Connected Car Experiences and Expanded Services

November 17, 2021

Sponsored by: Analog Devices

Analog Devices

Industry News

Viasat and Inmarsat to Combine, Creating a New Leading Global Communications Innovator

NXP and Ford Collaborate to Deliver Next‐Generation Connected Car Experiences and Expanded Services

Mercury Systems Completes Acquisition of Avalex Technologies

MaxLinear Simplifies Engineering Design for Home Connectivity Solutions

Kymeta, Intelsat and Fraunhofer IIS Successfully Demonstrate Satellite‐Enabled 5G Connectivity

For more daily news, visit mwjournal.com

eLearning

Upcoming Webinars - Register Now:
Impact of Copper Properties on High Reliability, High Performance PCB Designs?
Presented by: Rogers Corporation

Online Panel: Next Generation 4D Radar Sensors for In Cabin Sensing, ADAS and Autonomy
Presented by: NOFFZ Technologies, Rohde & Schwarz, Zadar Labs Inc. and Steradian Semiconductors

Featured Podcast:
Software Defined Radio Applications and Benefits

Access podcasts on-demand here.

November 2021 5G & IoT


Featured Articles:

 

RF GaN on Silicon: The Best of Two Worlds
 

Rubidium™ Signal Generators Redefine Industry Standards for Spectral Purity and Stability
 

The RF GaN Device Market: A Roller‐Coaster Ride
 

Werlatone

Advertisement

Werlatone SMT 180° Hybrid Combiners

High Power, Wideband 180° Hybrid Combiners
Covers the full 2000 to 6000 MHz Band
Rated at 100 W CW
Small Package Size, Excellent Repeatability


We Are High Power
Learn More

 

Featured White Papers

Discrete RF Power Transistor, IMFET, or MMIC Amplifier, Which is Best?
Richardson RFPD

NewSpace Terminal Testing Challenges and Considerations
Rohde & Schwarz

Testing Embedded Microcontrollers Using Multiple Types of Modular Instruments
Spectrum Instrumentation

Understanding the Basics of RF Signal Generation
Wireless Telecom Group

For these and more white papers, visit mwjournal.com/whitepapers

International Manufacturing Services

Advertisement

Thick Film High Power Chip Resistors and Terminations on Aluminum Nitride

The IMS N-Series thick film high power chip resistors and chip terminations on aluminum nitride are ideal for most applications requiring high thermal conductivity in a small size package. AlN is an ideal replacement for BeO with its high power dissipation and no environmental or health hazards. Thick film technology provides a stable resistive element at a very affordable price.

Learn More

Frequency Matters

Nov. 5: 5G/IoT issue, News/Acquisitions & Events, Space Market Interview

Jessen Wehrwein, Chief Marketing and Culture Officer at Quantic Electronics, joins Pat Hindle, Editorial Director at Microwave Journal, to cover the Nov. 5G and IoT issue articles, industry news, acquisitions and events plus preview an interview with Times Microwave Systems Director of Engineering, David Slack, about the trends/challenges of the space market.


Subscribe to Microwave Journal® magazine - the perfect complement to the breaking news and updates you receive from our website or your newsletter subscriptions.

The preceding is from Microwave Journal®, owned by Horizon House Publications Inc., at 685 Canton St., Norwood, MA, 02062, USA. We are online at www.mwjournal.com and are also available at 781-769-9750. Copyright © 2021. All Rights Reserved. Your email address has not been given to any Third Parties. You have been selected to receive this email because you opted-in to receive information when you provided your email address to Microwave Journal®. To ensure deliverability of emails from Microwave Journal®, we recommend that you whitelist our domain address: mwjournalemails.com.
@2021 AllWin Technologies, LLC,all rights reserved